| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EP4CE15F1717N | XILINX/赛灵思 |
BGA |
1313+ |
5 |
||||
| INA128U | 运放IC |
TI/德州仪器 |
SOP8 |
14+ |
357 |
|||
| MCP1253T-33X50I/MS | 工控元件 |
MICROCHIP/微芯 |
MSOP-8 |
1648+ |
2500 |
|||
| T491B107K010AT | 钽电容 |
KEMET/基美 |
SMD |
24+ |
50000 |
|||
| STM32F411CEU6TR | 32位MCU |
ST/意法 |
VFQFN48 |
2016+ |
425 |
|||
| RDA8955L | IC |
RDA |
BGA |
1930 |
3000 |
|||
| FBNB16A256G9KDBANJ4-SG | SPECTEK |
TSOP48 |
2018+ |
1695 |
||||
| XCR3256XL-10FTG256I | 单片机MCU |
XILINX/赛灵思 |
18+ |
200 |
||||
| STM32F103C8T6 | IC |
ST/意法 |
LQFP48 |
24+ |
9000 |
|||
| ADXL362BCCZ-RL | 其他单片机、电路板 |
ADI/亚德诺 |
LGA16 |
1645+ |
815 |
|||
| KLM8G1WE4A-A001 | 存储IC |
SAMSUNG/三星 |
BGA |
1328+ |
83 |
|||
| KLM8G1WE4A-A0010 | SAMSUNG/三星 |
BGA |
1322+ |
2560 |
||||
| HMC6623 | IC |
ADI/亚德诺 |
NA |
1819 |
650 |
|||
| PIC12F1822-I/SN | IC |
MICROCHIP/微芯 |
SOP8 |
24+ |
20000 |
|||
| BM71BLES1FC2-0B04AA | 射频IC |
MICROCHIP/微芯 |
MODULE-16 |
1912 |
1271 |
|||
| AGLN060V2-VQ100I | IC |
MICROCHIP/微芯 |
TQFP100 |
1702+ |
10 |
|||
| NRF51822-QFAA-R | 射频IC |
NORDIC |
QFN-48 |
18+ |
3000 |
|||
| FBNL84CNAKDBABJ4-SG | SPECTEK |
TSOP48 |
2018+ |
2000 |
||||
| MLF2012E100KT000 | 贴片电感 |
TDK/东电化 |
SMD |
24+ |
100000 |
|||
| KLMAG1JENB-BO41 | 存储IC |
SAMSUNG/三星 |
BGA |
1704+ |
609 |
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